is the industry standard titled "Design and Assembly Process Implementation for Bottom Termination Components (BTCs)." Published in 2020, it provides critical guidelines for the design and assembly of BTCs, such as QFN, DFN, and SON packages, focusing on achieving reliable solder joints and thermal performance. Overview of IPC-7093A
The IPC-7093A standard offers several benefits to electronics manufacturers, including:
The "A" revision introduced several significant updates to reflect modern manufacturing capabilities:
Compare your existing land patterns against the IPC-7093A annex tables. Are your thermal vias tented or untented? The standard recommends fully filled vias (copper filled) for thermal pads.