The is a physical layer specification developed by the MIPI Alliance (Mobile Industry Processor Interface). It serves as the de facto standard for high-speed, low-power serial interfaces in mobile devices. Version 2.5 represents a significant evolution of the standard, introducing substantial bandwidth improvements to support emerging high-resolution camera and display technologies (such as 4K/8K video and multi-camera setups) while maintaining the low-power characteristics essential for mobile battery life.
, v2.5 introduced critical features to support longer interconnects and higher efficiency in power-constrained environments. Key Features of MIPI D-PHY v2.5 mipi d-phy specification v2.5 pdf